2inch Sapphire Substrate Wafer High Purity Al2O3 99.999% DSP Diameter 50.8mm
Product Description
Sapphire Substrate is a premium-grade single-crystal carrier made from Al2O3 material, known for its exceptional quality and superior properties. It is specifically designed to meet the stringent requirements of high-end optical, optoelectronic, and semiconductor device applications.
One key feature of the Sapphire Substrate is its ultra-low Total Thickness Variation (TTV) of less than 5 μm. This remarkable TTV ensures uniformity and precision in thickness across the entire substrate, providing a highly stable and reliable platform for various manufacturing processes.
The Sapphire Substrate is available in two orientations: C-plane and M-plane. The C-plane orientation offers excellent parallelism, with a tight parallelism specification of 3 arcsecs. This parallelism ensures precise alignment and compatibility with optical systems, enabling optimal performance and accuracy in optical applications.
For applications that require a different crystal orientation, the M-plane Sapphire Substrate is available as an alternative. The M-plane orientation offers unique crystallographic properties that can be advantageous for specific device designs and performance requirements.
Sapphire Substrate is widely used in the production of sapphire windows and sapphire wafers. Its exceptional properties, including high hardness, excellent optical transparency, and resistance to chemical corrosion, make it an ideal choice for demanding applications.
Product parameter
| Properties | Target | Tolerance |
| Diameter | 50.8mm | ± 0.1mm |
| Thickness | 430μm | ±15μm |
| Surface orientation of C-plane | off C-axis to M0.2° | ± 0.1° |
| Primary flat length | 16mm | ±11mm |
| Primary flat orientation | A-plane(11-20) | ±0.1° |
| Back side Roughness | 0.8~1.2um | |
| Front side Roughness | <0.3nm |
| Wafer edge | R-type |
| Total Thickness Variation, TTV | ≤ 10μm(LTV≤5μm,5*5) |
| SORI | ≤10μm |
| Bow | -10 μm ≤ BOW ≤ 0 |
| Laser Mark | N/A |
| Package | 25 wafers in one cassette | |
| Trace ability | Wafers shall be traceable with respect to cassette number | |
Product Display
Packing and Shipping
Package and Shipment of Sapphire Substrates
To ensure the safe and secure transportation of sapphire substrates, they are meticulously packed using appropriate packaging materials. The substrates are typically placed in clean and secure plastic containers designed specifically for this purpose. These containers are clearly labeled with essential details such as the product name, quantity, and dimensions.
To maintain the pristine condition of the substrates and safeguard them from contaminants, the containers are sealed with a plastic cover. This protective cover prevents the entry of dust, dirt, and other particles that could potentially compromise the quality of the substrates.
For optimal protection during transit, the plastic containers are carefully placed within corrugated cardboard boxes. These boxes are chosen for their sturdy construction and ability to withstand handling and transportation stresses. The cardboard boxes are prominently marked with the customer's shipping address, the product name, and the number of containers enclosed. Additionally, the dimensions of the box are clearly indicated on the exterior to facilitate easy identification and handling.
Once the sapphire substrates are securely packaged, they are entrusted to a reputable shipping company responsible for their transportation to the designated destination. The shipping company assumes the responsibility of ensuring the timely and safe delivery of the substrates. However, any additional fees associated with the shipping, such as customs duties or import taxes, are typically the responsibility of the customer or the recipient of the products.
By employing meticulous packaging techniques and relying on reliable shipping partners, the packaging and shipping process for sapphire substrates aims to safeguard their integrity and ensure they reach their destination in optimal condition, ready for use in various high-end applications.
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